Huawei announced ambitious plans to produce advanced semiconductor chips by 2031, aiming to match industry standards set by leading companies. This development follows a significant breakthrough discussed at a semiconductor symposium in Shanghai.
The Chinese technology firm is targeting a transistor density comparable to the 1.4-nanometer processes that competitors such as Taiwan Semiconductor Manufacturing Corp and Samsung are expected to deploy. Although Huawei would still trail behind TSMC, which plans to begin production of its 1.4nm chips in 2028, the company believes it can provide a more economical alternative.
Huawei's chip department head, He Tingbo, emphasized that their upcoming process would be both "feasible and affordable." This announcement comes as Huawei continues to navigate the challenges posed by ongoing U.S. trade sanctions that have limited its access to essential semiconductor manufacturing equipment since 2019.
Currently, China’s largest semiconductor producer, Semiconductor Manufacturing International Corp, is delivering chips with a 7nm processor, including in Huawei's Mate 60 smartphones.