The use of PLA for 3D printing PC cases has notable limitations due to its susceptibility to deformation and cracking under mechanical stress. In particular, components like GPU braces are under constant pressure, making them particularly vulnerable to creep, which can lead to misalignment over time.
While PLA is a popular choice for prototypes and low-stress accessories, its performance can deteriorate in high-temperature environments typical of gaming PCs. Factors such as heat and vibration exacerbate the material's weaknesses, potentially resulting in issues like sagging or rattling components weeks after installation.
For more durable applications, alternatives like PETG, ABS, or nylon are recommended. These materials are better suited to withstand the sustained pressures and temperatures found within a PC case. Additionally, incorporating a metal rod or threaded insert into printed components can enhance rigidity and stability, providing a more reliable solution for critical parts like power supply brackets.