Tecno has unveiled a new modular smartphone concept, showcasing its vision for a customizable device ahead of MWC 2026. The company’s approach, named the “Modular Magnetic Interconnection Technology,” aims to create a sleeker, more functional smartphone using ultra-thin magnetic components. Unlike earlier modular attempts, such as Google’s discontinued Project Ara, Tecno focuses on a modular ecosystem that enhances accessory use rather than core components.
The device, measuring just 4.9mm thick, maintains a similar profile to contemporary flagship phones, even with the attachment of a 4.5mm power bank module. The phone utilizes Wi-Fi, Bluetooth, and mmWave technology to allow modules to connect seamlessly. Currently, around ten modules are available, including an Action Camera and a Telephoto Lens, each designed to fit within eight designated back zones for easy attachment.
Two distinct designs have been showcased: the ATOM edition, featuring a silver-aluminum finish with red accents, and the MODA edition, which embraces a more unconventional aesthetic. Although specifics on pricing and release dates remain undisclosed, Tecno aims to provide users with the flexibility to select hardware based on daily needs.